Fatigue Mechanism of Die-Attach Joints in IGBTs Under Low-Amplitude Temperature Swings Based on 3D Electro-Thermal-Mechanical FE Simulations.
Yongle HuangHongfei DengYifei LuoFei XiaoBinli LiuXin TangPublished in: IEEE Trans. Ind. Electron. (2021)
Keyphrases
- electrical power
- thermal imaging
- high temperature
- room temperature
- thermal conductivity
- finite element model
- air temperature
- heat transfer
- infrared
- high levels
- finite element
- computational model
- simulation model
- transmission line
- finite element analysis
- mechanical design
- human motion
- power plant
- neural network
- selection mechanism
- contact force
- degrees of freedom
- numerical simulations
- human body
- air conditioning