Warpage analysis of organic substrates for 2.1D packaging.

Sayuri Kohara Keishi Okamoto Hirokazu Noma Kazushige Toriyama Hiroyuki Mori

Published in: 3DIC (2015)

Keyphrases

wide range
pattern recognition
statistical analysis
data sets
learning algorithm
computer vision
image processing
case study
reinforcement learning
evolutionary algorithm
high speed
high density