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Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices.
Myeong-Hyeok Jeong
Jae-Won Kim
Byung-Hyun Kwak
Young-Bae Park
Byoung-Joon Kim
Young-Chang Joo
Published in:
BIODEVICES (2011)
Keyphrases
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mobile devices
levels of abstraction
neural network
high speed
highly reliable
real time
learning algorithm
website
three dimensional
expert systems
user interface
power grid
mechanical properties
confidence levels