Byung-Hyun Kwak

Publication Activity (10 Years)

Years Active: 2011-2011
Publications (10 Years): 0

Publications

Byung-Hyun Kwak, Sung-Hyuk Kim, Young-Bae Park
Current stressing effect on interfacial reaction characteristics of Cu pillar/Sn-3.5Ag microbumps for 3D integration. 3DIC (2011)
Myeong-Hyeok Jeong, Jae-Won Kim, Byung-Hyun Kwak, Young-Bae Park, Byoung-Joon Kim, Young-Chang Joo
Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices. BIODEVICES (2011)