Login / Signup

A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging.

Zhenyu LuoDeyong ChenJunbo WangYinan LiJian Chen
Published in: Sensors (2014)
Keyphrases
  • high density
  • wide range
  • higher level
  • integrated circuit
  • massively parallel
  • real time
  • neural network
  • computer science
  • high resolution
  • levels of abstraction