Advances and Challenges in Flip-Chip Packaging.
R. MahajanD. MallikRobert SankmanK. RadhakrishnanC. ChiuJ. HePublished in: CICC (2006)
Keyphrases
- high density
- high speed
- low cost
- current challenges
- key issues
- real world
- technical challenges
- recent advances
- lessons learned
- artificial intelligence
- single chip
- data sets
- vlsi implementation
- open issues
- recent developments
- real time
- neural network
- genetic algorithm
- information technology
- case study
- image processing
- e learning