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Flip-chip packaging solution for CMOS image sensor device.
Jong-heon Kim
In-Soo Kang
Chi-jung Song
Young-Jik Hur
Hak-Nam Kim
Esdy Baek
Tae-Jun Seo
Published in:
Microelectron. Reliab. (2004)
Keyphrases
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cmos image sensor
high speed
single chip
high density
dynamic range
real time
low cost
processing capabilities
parallel processing
data structure
multiscale
mobile devices
image sensor