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Investigating the CDM susceptibility of IC's at package and wafer level by capacitive coupled TLP.

Heinrich WolfHorst A. GieserDirk Walter
Published in: Microelectron. Reliab. (2009)
Keyphrases
  • integrated circuit
  • neural network
  • cooperative
  • real time
  • computer vision
  • face recognition
  • feature space
  • special case
  • object level