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Improved reliability of copper-cored solder joints under a harsh thermal cycling condition.

Yunsung KimHyelim ChoiHyoungjoo LeeDongjun ShinJinhan ChoHeeman Choe
Published in: Microelectron. Reliab. (2012)
Keyphrases
  • sufficient conditions
  • improved algorithm
  • neural network
  • infrared
  • information retrieval
  • database systems
  • multiscale
  • thin film