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Design and feasibility of multi-Gb/s quasi-serial vertical interconnects based on TSVs for 3D ICs.

Fengda SunAlessandro CevreroPanagiotis AthanasopoulosYusuf Leblebici
Published in: VLSI-SoC (2010)
Keyphrases
  • design process
  • real world
  • building blocks
  • input output
  • computer aided
  • engineering design
  • design tools
  • data sets
  • information systems
  • database systems
  • multi agent
  • search algorithm
  • artificial neural networks