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Stacking Signal TSV for Thermal Dissipation in Global Routing for 3-D IC.
Po-Yang Hsu
Hsien-Te Chen
TingTing Hwang
Published in:
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2014)
Keyphrases
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network topology
heat transfer
signal processing
infrared
non stationary
high frequency
ensemble learning
inter domain
neural network
image processing
multiscale
multi class
ad hoc networks
power plant
global information
radio frequency