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Thermotropic liquid crystalline polyimides toward high heat conducting materials for 3D chip stack.
Tomohide Murase
Hiroyuki Aikyou
Fumikazu Mizutani
Yu Shoji
Tomoya Higashihara
Mitsuru Ueda
Published in:
3DIC (2009)
Keyphrases
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low cost
wide range
mathematical model
video sequences
high density
vlsi design
materials science
thermal conductivity