The Method to Measure Si Thickness for Bond Line Thickness.
YangSub ParkKilBum KangSang-Yun YunSeongSoo KimPublished in: ICPRAM (2018)
Keyphrases
- cross section
- similarity measure
- dynamic programming
- detection method
- high precision
- significant improvement
- experimental evaluation
- clustering method
- fully automatic
- pairwise
- support vector machine
- segmentation method
- image processing
- objective function
- computational cost
- theoretical analysis
- detection algorithm
- dissimilarity measure