Multi-die Integration Using Advanced Packaging Technologies.
Hyung-Jin LeeRavi MahajanFarhana SheikhRamune NagisettyManish DeoPublished in: CICC (2020)
Keyphrases
- technical solutions
- web intelligence
- high density
- emerging technologies
- high speed
- human factors
- advanced technologies
- distributed heterogeneous
- database
- activity monitoring
- web enabled
- seamless integration
- content management
- web environment
- digital technologies
- st century
- design principles
- web services
- data mining
- real world
- real time