Three-dimensional on-chip inductor design based on through-silicon vias.

Feng Liang Si-Qi Zhao Aobo Chen Gaofeng Wang

Published in: ASICON (2013)

Keyphrases

high density
three dimensional
low cost
high speed
physical design
design process
cmos technology
single chip
design methodology
integrated circuit
engineering design
computer aided
evolutionary algorithm
design principles
d objects
user interface
real time