Rapid power cycling of flip-chip and CSP components on ceramic substrates.
Jaakko LenkkeriTuomo JaakolaPublished in: Microelectron. Reliab. (2001)
Keyphrases
- high density
- constraint satisfaction problems
- high speed
- low cost
- ibm power processor
- software components
- power consumption
- constraint programming
- arc consistency
- thin film
- chip design
- constraint propagation
- constraint satisfaction
- computational power
- constraint networks
- printed circuit boards
- evolutionary algorithm