Analytical model of internal heat transfer of a power chip with through silicon via.
Jingyu LiuYongyong WangXunyong YangFashun YangKui MaPublished in: ASICON (2017)
Keyphrases
- analytical model
- heat transfer
- high speed
- high density
- low cost
- silicon on insulator
- ibm power processor
- analytical models
- power consumption
- numerical simulations
- cmos technology
- chip design
- fluid flow
- simulation model
- heat exchanger
- temperature field
- low power
- multithreading
- finite element method
- metal oxide semiconductor
- computational fluid dynamics
- bit error rate
- power dissipation
- liquid crystal
- natural gas
- thermal conductivity
- operating conditions
- theoretical analysis
- active contours
- image sensor