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Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration.

Fengjiang WangDongyang LiShuang TianZhijie ZhangJiheng WangChao Yan
Published in: Microelectron. Reliab. (2017)
Keyphrases
  • electron microscopy
  • data sets
  • neural network
  • three dimensional
  • multiscale
  • cooperative
  • object recognition
  • evolutionary algorithm
  • x ray