Co-optimization of fault tolerance, wirelength and temperature mitigation in TSV-based 3D ICs.
Yi ZhaoS. Saqib KhursheedBashir M. Al-HashimiZhiwen ZhaoPublished in: VLSI-SoC (2016)
Keyphrases
- fault tolerance
- fault tolerant
- load balancing
- distributed systems
- distributed computing
- response time
- high availability
- mobile agents
- database replication
- failure recovery
- replicated databases
- group communication
- peer to peer
- data replication
- high performance computing
- single point of failure
- data sets
- distributed query processing
- component failures
- wireless sensor
- cooperative
- reinforcement learning
- knowledge base
- artificial intelligence
- databases