RF/wireless interconnect for inter- and intra-chip communications.
Mau-Chung Frank ChangVwani P. RoychowdhuryLiyang ZhangHyunchol ShinYongxi QianPublished in: Proc. IEEE (2001)
Keyphrases
- high speed
- multiple access
- wireless networks
- wireless communication
- radio frequency
- power dissipation
- low power
- communication technologies
- fourth generation
- ultra low power
- low cost
- relevance feedback
- signal strength
- communication systems
- analog vlsi
- mobile devices
- wireless link
- mobile users
- cellular networks
- power consumption
- received signal strength
- high density
- access points
- circuit design
- communication networks