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Intercircuit: Electroplating with Cavities for Fast Fabrication of Complex and High-Performance 3D Circuits.

Xiaolong LiCheng YaoYujie ZhouShuyue FengZhengke LiYiming ChengShichao HuangHaoye DongMengru XueGuanyun Wang
Published in: CHI Extended Abstracts (2024)
Keyphrases
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