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Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact.
Fang Liu
Guang Meng
Mei Zhao
Jun feng Zhao
Published in:
Microelectron. Reliab. (2009)
Keyphrases
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numerical analysis
real world
database
information retrieval
information technology
image enhancement
machine learning
decision making
pattern recognition
edge detection
higher level
statistical analysis
experimental data