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A laser-based instrument for measuring strain in electronic packages using coherent fibre-bundles.
Peter Dias-Lalcaca
Erwin Hack
Filippo Visintainer
Stefano Bernard
Urs Sennhauser
Published in:
Microelectron. Reliab. (2004)
Keyphrases
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solder ball connect
design automation
database
software packages
decision making
three dimensional
infrared
finite element analysis
bulletin board
particle image velocimetry