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A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process.
Changsoo Jang
Seongyoung Han
Hangyu Kim
Sayoon Kang
Published in:
Microelectron. Reliab. (2006)
Keyphrases
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high speed
low cost
numerical analysis
data analysis
expert systems
image analysis
physical design
real time
high density