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Temperature-dependent stress-induced voiding in dual-damascene Cu interconnects.
ZhenYu Wu
Yintang Yang
Changchun Chai
Yuejin Li
JiaYou Wang
Jing Liu
Bin Liu
Published in:
Microelectron. Reliab. (2008)
Keyphrases
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integrated circuit
input output
mechanical properties
neural network
primal dual
heat flow
genetic algorithm
electron microscopy
database
three dimensional
artificial neural networks
evolutionary algorithm
numerical simulations