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Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps.
Muhammad Salman Al Farisi
Hideki Hirano
Shuji Tanaka
Published in:
NEMS (2016)
Keyphrases
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high density
higher level
high speed
image compression
information integration
machine learning
information retrieval
knowledge base
multiresolution
data fusion
compression algorithm
compression ratio
data compression
integrated circuit