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Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power.

Hao YuYiyu ShiLei HeTanay Karnik
Published in: ISLPED (2006)
Keyphrases
  • spatially variant
  • multiscale
  • mathematical morphology
  • spatially varying
  • structuring elements
  • translation invariant
  • least squares
  • morphological operators