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Residual stresses in microelectronics induced by thermoset packaging materials during cure.
Marcel H. H. Meuwissen
Hedzer A. de Boer
Henk L. A. H. Steijvers
Piet J. G. Schreurs
Marc G. D. Geers
Published in:
Microelectron. Reliab. (2004)
Keyphrases
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