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TSV by 355 UV laser for 4G component packaging with micro-electroforming.
C. T. Pan
Y. C. Chen
S. Y. Wang
Y. T. Cheng
C. K. Yen
Y. L. Lin
W. C. Shih
Published in:
Microelectron. Reliab. (2017)
Keyphrases
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high speed
software components
data sets
high density
genetic algorithm
computational complexity
artificial neural networks
control system
fiber optic
electro mechanical systems