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On effective and efficient in-field TSV repair for stacked 3D ICs.

Li JiangFangming YeQiang XuKrishnendu ChakrabartyBill Eklow
Published in: DAC (2013)
Keyphrases
  • computationally efficient
  • highly efficient
  • image processing
  • real time
  • data sets
  • information systems
  • multimedia
  • multiscale
  • probabilistic model
  • cost effective
  • published literature