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Compact thermal modeling for packaged microprocessor design with practical power maps.
Zao Liu
Sheldon X.-D. Tan
Hai Wang
Yingbo Hua
Ashish Gupta
Published in:
Integr. (2014)
Keyphrases
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design methodology
modeling method
modeling language
circuit design
case study
low cost
engineering design
real time
data sets
face recognition
power consumption
computer aided
chip design