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Compact thermal modeling for packaged microprocessor design with practical power maps.

Zao LiuSheldon X.-D. TanHai WangYingbo HuaAshish Gupta
Published in: Integr. (2014)
Keyphrases
  • design methodology
  • modeling method
  • modeling language
  • circuit design
  • case study
  • low cost
  • engineering design
  • real time
  • data sets
  • face recognition
  • power consumption
  • computer aided
  • chip design