Reactivation of Spares for Off-Chip Memory Repair After Die Stacking in a 3-D IC With TSVs.
Yung-Fa ChouDing-Ming KwaiMing-Der ShiehCheng-Wen WuPublished in: IEEE Trans. Circuits Syst. I Regul. Pap. (2013)
Keyphrases
- high speed
- random access memory
- memory subsystem
- memory access
- memory requirements
- memory usage
- integrated circuit
- digital signal processors
- analog vlsi
- computational power
- real time
- memory space
- level parallelism
- consistent query answering
- damage assessment
- computing power
- main memory
- low cost
- multithreading
- memory size
- failure rate
- ensemble learning
- historical data
- processor core
- database management systems