Login / Signup
Hybrid wire-surface wave interconnects for next-generation networks-on-chip.
Ammar Karkar
Janice E. Turner
Kenneth Tong
Ra'ed Al-Dujaily
Terrence S. T. Mak
Alex Yakovlev
Fei Xia
Published in:
IET Comput. Digit. Tech. (2013)
Keyphrases
</>
next generation networks
low cost
high speed
quality of service
location based services
cellular networks
power dissipation
ip networks
multimedia services
mobile devices
image sequences
low power
ambient assisted living
video on demand
cmos technology