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Analytical equivalent circuit modeling and analysis of complex BGA for 3D silicon-interposer packaging.

Lei TangKangrong LiXingshe ZhouQiao YangPenghui PanDaowei WuBaoxia LiYanling WangNailiang KuangLiaoliao Zhang
Published in: Microelectron. J. (2024)
Keyphrases
  • real time
  • state space
  • denoising
  • high speed
  • complex systems
  • high density