AC Resistance of Copper Clad Aluminum Wires.

Ning Guan Chihiro Kamidaki Takashi Shinmoto Ken'ichiro Yashiro

Published in: IEICE Trans. Commun. (2013)

Keyphrases

thin film
high density
multi layer
arc consistency
silicon nitride
machine learning
computer vision
image segmentation
three dimensional
power supply
learning algorithm
np complete