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Monolithic Co-integration of III-V Materials into Foundry Si-CMOS in a Single Chip for Novel Integrated Circuits.

Xing ZhouSiau Ben ChiahBinit SyamalKenneth Eng-Kian Lee
Published in: ASICON (2019)
Keyphrases
  • single chip
  • integrated circuit
  • low power
  • cmos image sensor
  • low cost
  • image sensor
  • embedded processors
  • power consumption
  • electron beam
  • high speed
  • real time
  • video camera
  • metal oxide semiconductor