Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer.
Jui-Chin ChenJohn H. LauTzu-Chien HsuChien-Chou ChenPei-Jer TzengPo-Chih ChangChun-Hsien ChienYiu-Hsiang ChangShang-Chun ChenYu-Chen HsinSue-Chen LiaoCha-Hsin LinTzu-Kun KuMing-Jer KaoPublished in: 3DIC (2013)
Keyphrases
- real world
- lessons learned
- integrated circuit
- high speed
- semiconductor manufacturing
- machine learning
- open issues
- design principles
- key issues
- video sequences
- data structure
- neural network
- image acquisition
- bayesian networks
- massively parallel
- technical challenges
- application scenarios
- artificial intelligence
- electron microscopy
- data mining
- computational challenges