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Virtual Metrology for Semiconductor Chemical Mechanical Planarization Process Using Wide & Deep Learning.

Fuzuo ZhangWenlan JiangHuan-gang Wang
Published in: ICCPR (2021)
Keyphrases
  • deep learning
  • data sets
  • maximum likelihood
  • process control
  • machine learning
  • decision making
  • high dimensional
  • online learning
  • unsupervised feature learning