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Review of silver nanoparticle based die attach materials for high power/temperature applications.

Seyed Amir PaknejadSamjid H. Mannan
Published in: Microelectron. Reliab. (2017)
Keyphrases
  • high power
  • low power
  • high density
  • power supply
  • power consumption
  • thermal conductivity
  • low cost
  • real time
  • decision making
  • computational complexity
  • data center
  • ofdm system