Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization.
Brice RogiéLorenzo CodecasaEric Monier-VinardValentin BissuelNajib LaraqiOlivier DanielDario D'AmoreAlessandro MagnaniVincenzo d'AlessandroNiccolò RinaldiPublished in: Microelectron. Reliab. (2018)