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Dedicated MEMS-based test structure for 3D SiP interconnects reliability investigation.

Tomasz BieniekGrzegorz JanczykRafal DobrowolskiDariusz SzmigielMagdalena EkwinskaPiotr GrabiecPawel JanusJerzy Zajac
Published in: 3DIC (2013)
Keyphrases
  • artificial intelligence
  • information systems
  • input output
  • test data
  • network structure
  • structural properties
  • lower cost