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Capacitance Measurements of Two-Dimensional and Three-Dimensional IC Interconnect Structures by Quasi-Static C-V Technique.
Michele Stucchi
Dimitrios Velenis
Guruprasad Katti
Published in:
IEEE Trans. Instrum. Meas. (2012)
Keyphrases
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three dimensional
quasi static
high speed
multi view
displacement field
image sequences
d objects
computer vision
cost function
wireless sensor networks
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