Flip-Chip Packaged Micro-Plate For Low Cost Thermal Multiplexing.
Yubo MiaoChong Ser ChongTaichong ChaiYu ChenQuanbo ZouTie YanChew-Kiat HengTit Meng LimPublished in: Int. J. Comput. Eng. Sci. (2003)
Keyphrases
- low cost
- single chip
- infrared
- low power
- hardware and software
- low power consumption
- video streams
- solder ball connect
- digital camera
- real time
- power plant
- noise reduction
- data acquisition
- electro mechanical systems
- embedded systems
- high end
- room temperature
- high temperature
- license plate
- high speed
- thermal conductivity