An optimized 3D-stacked memory architecture by exploiting excessive, high-density TSV bandwidth.
Dong Hyuk WooNak Hee SeongDean L. LewisHsien-Hsin S. LeePublished in: HPCA (2010)
Keyphrases
- high density
- high bandwidth
- low density
- close proximity
- high power
- data center
- associative memory
- thin film
- management system
- magnetic recording
- magnetic tape
- memory management
- computational power
- computing power
- multi layer
- memory requirements
- software architecture
- real time
- storage capacity
- multithreading
- field effect transistors
- network bandwidth
- video streaming
- network architecture
- memory access
- main memory
- level parallelism