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Toward Improvement and Evaluation of Reconstruction Capability of CapsNet-Based Wafer Map Defect Pattern Classifier.

Yuki YamanakaMasayuki AraiYoshikazu NagamuraSatoshi Fukumoto
Published in: ITC-Asia (2023)
Keyphrases
  • three dimensional
  • evaluation method
  • database
  • evaluation model
  • reconstruction method
  • defect detection
  • gold standard
  • semiconductor manufacturing
  • maximum a posteriori probability