Signal through-the-silicon via planning and pin assignment for thermal and wire length optimization in 3D ICs.
Xu HeSheqin DongYuchun MaPublished in: Integr. (2010)
Keyphrases
- signal processing
- optimization process
- optimization problems
- optimization algorithm
- low cost
- heuristic search
- non stationary
- optimization method
- global optimization
- infrared
- high frequency
- planning problems
- constrained optimization
- planning process
- frequency domain
- high speed
- combinatorial optimization
- image processing
- ai planning
- joint optimization