Packaging and integration technologies for future high-frequency power supplies.
Seán Cian O'MathunaPatrick ByrneGerald DuffyWeimin ChenMatthias LudwigTerence O'DonnellPaul McCloskeyMaeve DuffyPublished in: IEEE Trans. Ind. Electron. (2004)
Keyphrases
- high frequency
- low frequency
- visual quality
- high resolution
- wavelet transform
- high frequencies
- subband
- low pass
- discrete wavelet transform
- wavelet coefficients
- low and high frequency
- multi resolution analysis
- data fusion
- power supply
- high frequency components
- high density
- wavelet decomposition
- blocking artifacts
- high speed