Login / Signup

An In-Situ Technique for Measuring the Individual Contact Resistance between the Pins of an IC Package and the Board of a Flexible Hybrid Electronic System.

Rafid Adnan KhanMohammad Muhtady MuhaisinGordon W. Roberts
Published in: ISCAS (2020)
Keyphrases
  • software package
  • integrated circuit
  • high density
  • hybrid approaches
  • data sets
  • neural network
  • real world
  • computer vision
  • decision making
  • wide range
  • pairwise
  • hidden markov models
  • magneto optic