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Analysis of thermal characteristics and mechanism of degradation of flip-chip high power LEDs.
Chien-Ping Wang
Tzung-Te Chen
Han-Kuei Fu
Tien-Li Chang
Pei-Ting Chou
Mu-Tao Chu
Published in:
Microelectron. Reliab. (2012)
Keyphrases
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high power
fuzzy logic
low cost
cost effective
real time
multiresolution
maximum likelihood
computer simulation
high density