Thermal-aware floorplanner for 3D IC, including TSVs, liquid microchannels and thermal domains optimization.
David CuestaJosé L. Risco-MartínJosé L. AyalaJosé Ignacio HidalgoPublished in: Appl. Soft Comput. (2015)
Keyphrases
- infrared
- heat transfer
- solder ball connect
- thermal images
- visible spectrum
- optimization problems
- optimization algorithm
- application domains
- power plant
- mathematical model
- finite element analysis
- continuous domains
- optimization model
- constrained optimization
- real time
- cost function
- bayesian networks
- decision trees
- website
- information systems
- machine learning